Title

New Approach to Improve the Breakdown Strength for Thick Dielectrics: A Theoretical Study

Authors

Sijay Huang, University of Alabama in Huntsville
Biswajit Ray, University of Alabama in Huntsville

Files

Department

Electrical and Computer Engineering

College Name

College of Engineering

Publication Date

10-26-2017

Document Type

Poster

Disciplines

Electrical and Electronics

Comments

10th Wernher von Braun Memorial Symposium

Recommended Citation

Huang, Sijay and Ray, Biswajit, "New Approach to Improve the Breakdown Strength for Thick Dielectrics: A Theoretical Study" (2017). Von Braun Symposium Student Posters. 206.
https://louis.uah.edu/vbs-posters/206