Analysis of the Design and Manufacure of a Printed Circuit Board for a High Altitude Balloon Payload
Date of Award
12-1-2023
Document Type
Thesis
Department
Center for Modeling, Simulation and Analysis (CMSA)
Committee Chair
Michael P.J. Benfield
Recommended Citation
Crosby, Peyton Reade, "Analysis of the Design and Manufacure of a Printed Circuit Board for a High Altitude Balloon Payload" (2023). Honors Capstone Projects and Theses. 863.
https://louis.uah.edu/honors-capstones/863
COinS